Chinese semiconductor stocks surged in Hong Kong following Huawei’s announcement of a potential 1.4nm chip breakthrough using “LogicFolding” technology by 2031. This development aims to narrow the gap with global leaders and bolster China’s AI ambitions amid US restrictions. While promising, the technology’s commercial viability remains to be seen, with a key test expected with upcoming Kirin mobile chips.
Originally published by The Economic Times https://economictimes.indiatimes.com/markets